Placement Metrics

Placement Accuracy

±3μm@3σ

With mounting head heating function

Repeated Positioning Accuracy

±2μm@3σ

Angular Accuracy

±0.1@3σ

Placement Force

10g~500g

With nozzle soft-contact function

Force Accuracy

≤1g

X/Y/Z Travel Range

X:440mm,Y:480mm,Z:50mm

Placement Head Rotation

θ: ±360°

UPH

≥1000(With bottom camera calibration)  ≥2000(Without bottom camera calibration)

Eutectic Module

Eutectic hot stage dimensious

50mm*50mm

With M2/N2H2 Inert-gas protection

Eutectic heating temperature

500℃(Up to 500℃)

Eutectic table temperature uniformity

±3℃

Eutectic heating rate

40℃/S(Up to 40℃/s)

Pulse heating method

Dispensing Module

Method

Dot dispensing、Line dispensing、Dipper dispensing

With customized dispensing pattern function

Height Measurement

Laser non-contact/Contact-probeheight measurement

Dispensing Head Type

Dual dispensing head,Pneumatic dispensing

control valve+Screw-type dispensing control valve

Programmable dispensing parameters

Material Handing Module

Wafer Cassette Capacity

30

Waffle Packs、Gel-Pak

Nozzle Quantity

14

Chip Size

0.2mm~25mm(L/H),0.03mm~5mm(W)

Carrier Size

W:90~150mm,L:100~300mm,W:0.5~15mm

Loading/Unloading System

With automaticloading and unloading lifting table

Number of storage boxes is 6

Conveyor Guide

W:90~150mm,H:950mm

Supports stand-alone operation and connection to automated production lines

Vision Module

Camera Resolution

5MP

With positive and negative detection

FOV

4.5mm*3.7mm

Lighting

Coaxial+RGB ring light

Programmable with customizable background

Image Recognition

Shape/Edge/Area Detection

Installation

Communication

SMEMA,SECS/GEM

Power Supply

220V@50Hz

Power Consumption

3500W

Compressed Air

0.4~0.8MPa

Vacuum

-90~-70KPa

Dimension

2580mm(L)*1280mm(W)*1690mm(H)

Weight

1500kg