Bonding Module

Placement Accuracy

±3μm@3g

Repeated Positioning Accuracy

±2μm@3o

Angular Accuracy

±0.1°@3o

Placement Force

5~7500g

With nozzle soft-contact function

Force Accuracy

≤1g

With die stacking function

X/Y/Z travel range

X:440mm,Y:480mm,Z:50mm

Electronic and physical limits

X/Y/Z Positioning Accuracy

±3μm@3 g

X/Y/Z Resolution

0.1μm

X/Y/Z Moving Speed

1000 mm/s

Bond Head Rotation Angle

θ:±360°

Angular Resolution

0.001°

UPH

2000

Dispensing Module

Method

Dot dispensing, Line dispensing

With customized dispensing pattern function

Accuracy

±5μm@3o

Air Pressure

0.01~0.6 MPa

Min. Dot Diameter

0.2mm

Travel Range

X: 150mm, Y: 150mm, Z: 50mm

Height Measurement

Mechanical contact-auto measurement

Height accuracy

1μm

Dispensing Valve

Pneumatic Dispensing Valve

Automatic adjustable dispensing pressure

Material Handling Module

Chip Tray Quantity

24/Waffle  pack/Gel-Pak@2”x2”

Waffle Pack, Gel-Pak

Nozzle Quantity

15

Die Size

0.2mm~25mm (L×W), 0.03mm~5mm (W)

Carrier Size

W:90~150mm,L:100~300mm,W:0.5~15mm

Conveyor Guide

W:90~150mm,H:950mm

Supports stand-alone operation and connection to automated production lines

Vision Module

Camera Resolution

5MP

With positive and negative detection

FOV

4.5mm*3.7mm

Lighting

Coaxial + RGB ring light

Programmable with customizable background

Image Recognition

Shape/Edge/Area Detection

Installation

Communication

SMEMA, SECS/GEM

Power Supply

220V@50Hz

Power Consumption

3500W

Compressed Air

0.4~0.8MPa

Vacuum

-90～-70KPa

Dimension

1300mm(L)*1250mm(W)*1690mm(H)

Weight

1500kg