Products
W8600 RB gold ribbon bonding machine features closed-loop pressure control and temperature compensation to ensure uniform and stable solder joints. It is equipped with a 10-inch touch screen and is suitable for microwave, MEMS, optoelectronics and other chip packaging. The body is lightweight and easy to operate.
86-15688870591
cedric@cedriccn.com
Product Highlights
Application Fields
Application Effects
Technical Parameters
Items | Parameters |
Welding Wire Type | 50*12.5μm~300*25.4μm Gold belt |
Z-Axis Travel | 0~19mm |
Capillary Length | 16mm/19mm/25mm |
Bonding Force | 0~250g |
Ultrasonic | 10W |
Lifting Platform | 268mm*272mm |
LCD | 10-inch |
Wire Spool | 1/2-inch, 2-inch |
Wire Feeding Method | 90° |
Clamping table temperature range | RT~200℃ |
Standard Equipment | Bonding Machine, 1/2-inch Wire Spool, Stereo Microscope, LED Ring Illuminator, Head Clamp Stage (with PID Controller 200℃) |
Installation Requirements
Items | Parameters |
Input Voltage | 220VAC±10%@50Hz |
Rated Power | 500W |
Dimension | 610mm(L)*595mm(W)*355mm(H) |
Weight | 48Kg |
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