Products
W8600 BA multifunctional wire bonding machine, closed-loop pressure and temperature control compensation, suitable for gold, platinum, copper, silver bonding wires, supports multiple bonding processes, 10-inch touch screen, can process microwave, MEMS, optoelectronics and other chip devices.
86-15688870591
cedric@cedriccn.com
Product Highlights
Application Fields
Application Effects
Technical Parameters
Items | Parameters |
Welding Wire Type | Gold wire (15~100μm), Platinum wire (18~25μm), Copper wire (18~50μm), Silver wire (18~50μm) |
Z-Axis Travel | 19mm |
Capillary Length | 16 mm/19 mm |
Bonding Force | 0~255g |
Ultrasonic | 10W |
Lifting Platform | 268mm*272mm |
LCD | 10-inch |
Wire Spool | 1/2-inch, 2-inch |
Wire Feeding Method | Ball bonding, Solder ball placement, BBOS (Bond Ball On Stitch), BSOB (Bond Stick On Ball) |
Clamping table temperature range | RT~200℃ |
Standard Equipment | Bonding Machine, 1/2-inch Wire Spool, Stereo Microscope, LED Ring Illuminator, Head Clamp Stage (with PID Controller 200℃) |
Installation Requirements
Items | Parameters |
Input Voltage | 220V@50Hz |
Rated Power | 0.4~0.8Mpa |
Dimension | 1300mm(L*1250mm(W*1690mm(H) |
Weight | 1000Kg |
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