Bonding Module

Placement Accuracy

±3μm@3o

Repeated Positioning Accuracy

±2μm@3o

Angular Accuracy

±0.1°@3o

Placement Force

5g~1000g

With nozzle soft-contact function

Force Accuracy

≤1g

With die stacking function

X/Y/Z travel range

X:440mm,Y:480mm,Z:50mm

Electronic and physical limits

X/Y/Z Positioning Accuracy

±2μm@3o

X/Y/Z Resolution

0.1μm

X/Y/Z Moving Speed

1000 mm/s

Bond Head Rotation Angle

θ:±360°

Angular Resolution

0.001°

UPH

2000

Material Handling Module

Chip Tray Quantity

24/Waffle  Pack@2“×2”

Waffle Packs, Gel-Pak

Nozzle Quantity

13

Chip Size

0.2mm~25mm (L/W), 0.03mm~5mm (T)

Placement Chamber Depth

13mm

Carrier Size

W:90～150mm,L:100～300mm,W:0.5～15mm

Conveyor Guide

W:90~150mm,H:950mm

Supports stand-alone operation and connection to automated production lines

Vision Module

Camera Resolution

5MP

With positive and negative detection

FOV

4.5mm*3.7mm

Lighting

Coaxial + RGB ring light

Programmable with customizable background

Image recognition

Shape/Edge/Areadetection

Communication

SMEMA, SECS/GEM

Power Supply

220V@50Hz

Installation

Power Consumption

2300W

Compressed Air

0.4～0.8MPa

Vacuum

-90～-70KPa

Dimension

1100mm(L)*1120mm(W)*1720mm(H)

Weight

1100kg