
W8600 WB multifunctional wire bonding machine, closed-loop pressure and temperature compensation, suitable for gold, aluminum, platinum wire and gold ribbon, supports multiple bonding processes, 10-inch touch screen, lightweight body, suitable for microwave, MEMS, optoelectronic chip packaging
86-15688870591
cedric@cedriccn.com
Product Highlights
Application Fields
Application Effects
Technical Parameters
Items | Parameters |
Welding Wire Type | Gold wire (15~100μm), aluminum wire (18~100μm), platinum wire (18~25μm), gold ribbon (12.7*50μm~25.4*300μm) |
Z-Axis Travel | 19mm |
Capillary Length | 16mm/19mm/25mm |
Bonding Force | 0~255g |
Ultrasonic | 10W |
Lfting Platform | 268mm*272mm |
LCD | 10-inch |
Wire Spool | 1/2-inch, 2-inch |
Wire Feeding Method | 90°、45° |
Welding mode | Welding、 ball bonding、 solder ball placement、 BBOS (Bond Ball On Stitch), BSOB (Bond Stick On Ball) |
Clamping table temperature range | RT~200℃ |
Standard Equipment | Bonding Machine, 1/2-inch Wire Spool, Stereo Microscope, LED Ring Illuminator, Head Clamp Stage (with PID Controller 200℃) |
Installation Requirements
Items | Parameters |
Input Voltage | 220VAC±10%@50Hz |
Rated Power | 500W |
Dimension | 610mm(L)*595mm(W)*355mm(H) |
Weight | 48Kg |
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