Products
The D3200 multi-function placement machine supports two placement processes: epoxy and eutectic. The two heads are interchangeable. The pressure and temperature control are precise and controllable. It is suitable for semiconductor devices such as microwaves, MEMS, and radio frequency chips. The large screen operation is user-friendly, and the overall structure is compact. It is suitable for the placement of various deep cavity components.
86-15688870591
cedric@cedriccn.com
Product Highlights:
Application Fields:
Technical Parameters:
Items | Parameters |
Type of patching material | Epoxy chip (0.2-25mm), eutectic chip (0.15-8mm) |
Z-axis travel | 19mm |
XY journey | 15mm×15mm |
Soldering pressure | 10-150g |
Rotation angle of the suction tip | 360° |
lift platform | 268mm×272mm |
Eutectic friction direction | Left/Right/Both Ways |
Eutectic friction amplitude | 20-510um |
The number of eutectic cycles | 0-100 |
Heating station temperature | 400℃(Vacuum adsorption with nitrogen gas protection) |
Gauge tube capacity | 3cc/5cc |
Installation Requirements:
Items | Parameters |
Power supply | 220VAC±10%@50Hz |
Power | 500W |
Size | 610mm(L)×595mm(W)×355mm(H) |
Weight | 50kg |
compressed air | ≥0.5MPa |
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